Sea-of-cells array of transistors

ABSTRACT

The invention concerns integrated circuits in which a MACRO is embedded in a standard cell array. One level of metal is devoted exclusively to non-local interconnect, and a layer of polysilicon is devoted to local interconnect, thereby saving significant space.

This is a continuation of application Ser. No. 08/174,654 filed Dec. 27,1993, now abandoned.

The invention concerns an Integrated Circuit (IC) architecture in whichindividual transistors, each of which resides in a "cell," are arrangedin a matrix-like array, thereby forming a "sea" of the cells.

Groups of the cells are interconnected among themselves, by localinterconnect, into functional units. (Some of these units are called"MACROs.") The local interconnect in the units is prohibited fromoccupying certain layers, such as second-layer metal. The prohibitedlayer is used instead to connect the individual units to each other.

BACKGROUND OF THE INVENTION

Several practices, common in the prior art, tend to utilize resources inintegrated circuits (ICs) in an inefficient manner. These are:

1. The use of metal level 2 for local interconnect.

2. The use of metallization located above a row of transistors forinterconnect for other transistors, rendering the row of transistorsnon-usable.

3. The use of a cell spacing (or "row pitch") in a MACRO which isdifferent from that of the rest of the array of standard cells intowhich the MACRO is embedded.

These practices will be addressed individually.

Metal Level 2 is Used for Local Interconnect

CMOS Inverters Generally

FIG. 1 illustrates a common approach to constructing a CMOS inverter. Ap-well and an n-well are constructed in a silicon substrate 3. A gate G,commonly made of polysilicon, extends across the wells.

In the p-well, an electric field produced by the gate G generates ann-type channel (not shown) in which electrons flow from a source S to adrain D. In the n-well, this electric field generates an opposite typeof channel, namely, a p-type channel (not shown), in which holes flowfrom a source S to a drain D. This electric field modulates the flow ofthe electrons and holes, and thus modulates the current flowing throughthe inverter.

Electric power for the inverter is provided by bus lines Vss and Vdd.These bus lines are generally fabricated in first-layer metal, or METAL1 in FIG. 2. ("POLY" in that Figure refers to polysilicon.)

Trace T is Generally Located in METAL 2

The two drains D in FIG. 1 are connected by an interconnect trace T. TheInventor herein has observed that this trace T is fabricated usingsecond-layer metal, which is labeled METAL 2 in FIG. 2. Locating thistrace T in METAL 2 presents obstacles to routing other traces, as FIG. 3illustrates. For example, trace TT cannot take the path shown, becausetrace T blocks the way. Thus, the freedom of routing of traces such asTT is limited by the local interconnect traces T.

(FIG. 1 has been simplified for ease of illustration. Insulating layersare not shown, and the vias V have been simplified. FIG. 4 illustrates amore detailed view. Vias are not pure vertical columns, as in thesimplified FIG. 1, but, for various technical reasons, take the formshown in FIG. 5.)

When Macros are Embedded, the Power Busses Become Disrupted

Standard Cell Arrays Generally

The cells of a standard cell array typically contain a simple logicfunction, such as an inverter, a NAND gate, or a D-flip flop. Thetransistors in these cells are specifically designed for the driverequirements of the particular cell, and spacing of these transistorsdepends upon such factors as the location of contacts within the cells.

The spacing, or pitch, between rows of cells is determined by (a) thenumber of interconnect lines fabricated from METAL 1 (shown in FIG. 2)and (b) the cell height. The cell height, in turn, depends upon thetransistor configuration within the cells. FIG. 6 illustrates theseterms.

The interconnect lines fabricated from METAL 1 are typically laid out byan automated device, or computer program, called a "router," or"auto-router." Different routers have different algorithms for layingout the lines, so that different routers will produce differentinterconnect patterns, even though the end result of the connections maybe the same.

Thus, in general, the row pitch is determined by (a) the router used tointerconnect the cells in the standard cell array and (b) the height ofthe individual cells.

Wiring is Primary Consumer of Space

It is very important to efficiently arrange the wiring in an IC because,in general, the wiring running from transistor-to-transistor consumesmore space than the transistors themselves. (The wiring consists oftraces fabricated from the METAL layers shown in FIG. 2.) Restated, thesize of the IC is generally determined by how efficiently the wiring canbe routed and compacted, and not by how many transistors the ICcontains.

In a standard cell array, such as that shown in FIG. 6, when more wiringis needed, it is common to use the METAL, shown in FIG. 2, which islocated between rows of cells in FIG. 6, such as at location L1. Ifadditional METAL 2 is required, the cells are then spaced apart, asshown in FIG. 6, so that metal lines can be run between them, asindicated.

Embedding MACROs into Standard Cell Arrays Wastes Space

MACROs are frequently incorporated into ICs containing standard cellarrays. A MACRO is a block of transistors which have been optimized toperform a specific function. In a MACRO, the layout of the individualtransistors, their operating characteristics, and their interconnectionsmay have all been matched to each other for optimum performance. Thus,typically, a MACRO is constructed from different sizes of transistors,which are embedded into the standard cell array as shown in FIG. 7.

Since, in general, the ROW PITCH of the MACRO is different from that ofthe standard cell array, the power busses Vdd and Vss will beinterrupted. To accommodate this interruption, the power busses arere-designed as a ring which surrounds the MACRO. FIG. 7 shows such aring generically.

Recapitulation

Therefore,

1. The use of METAL 2 for local interconnect presents obstacles to thefree routing of other interconnects over the cell, as illustrated inFIG. 3.

2. In a standard cell array, the ROW PITCH is determined by the cellheight and the number of lines of METAL 1 interconnect placed betweenthe cell rows by the auto-router.

3. The row pitch in a MACRO is generally different from that of astandard cell array into which the MACRO is embedded. This different rowpitch disrupts the power bus system, requiring a ring of power busses tobe formed around the MACRO. This approach wastes space within the IC.

OBJECTS OF THE INVENTION

It is an object of the invention to provide an improved approach to thelayout of an integrated circuit.

It is a further object to provide a method of compactinginterconnections in integrated circuits.

It is yet a further object of the invention to provide a method forimproving the performance of the integrated circuit after the layout hasbeen completed, without requiring a new layout to be generated.

SUMMARY OF THE INVENTION

In one form of the invention, a MACRO, when embedded within a standardcell array, uses the same row pitch as that of the standard cell arrayitself.

In another form of the invention, the interconnect within the standardcell is confined to METAL 1 and polysilicon layers, so that METAL 2 isfree for routing over the cell.

In still another form of the invention, the diffusion layer of thetransistors within the standard cells is designed for optimumperformance after the layout has been completed, rather than at anothertime.

BRIEF DESCRIPTIONS OF THE DRAWINGS

FIG. 1 illustrates a CMOS inverter of the prior art.

FIG. 2 illustrates the different layers of metallization used in ICfabrication.

FIG. 3 illustrates the proliferation of traces T, shown in FIG. 1, whichcan occur when trace T is fabricated in a layer of metallization, suchas METAL 2 in FIG. 2.

FIG. 4 illustrates the CMOS inverter of FIG. 1, but in greater detail.

FIG. 5 is a highly simplified depiction of a via of FIG. 4.Like-numbered structures correspond in both Figures. In an actual via,the metal in the via C is a portion of element D1. The outline C in FIG.5 is the cutout in the dielectric layer. Metal layer D1 flows down intothe via C.

FIG. 6 illustrates a standard cell array.

FIG. 7 illustrates a common approach to embedding a MACRO in a standardcell array.

FIG. 8 illustrates one form of the invention.

FIG. 9 illustrates an imaginary grid on which traces are laid out in theprior art.

FIG. 10A, 10B, 10C, and 10D illustrate the different effective widths ofdifferent traces.

FIG. 11 illustrates different possible ways to pack different traces, ofdifferent effective widths, between the traces T of FIGS. 1 and 3.

FIG. 12 illustrates how different traces of different effective widthscan be packed on a layer of metallization which lacks the traces T ofFIG. 3.

FIG. 13 illustrates embedding of a MACRO into a standard cell array,according to the invention.

FIG. 14 illustrates the WIDTH of the CHANNEL of a field-effecttransistor.

FIG. 15 illustrates an analog switch of the prior art.

DETAILED DESCRIPTION OF THE INVENTION

Fabricate Drain-Drain Local Interconnect in Polysilicon FIG. 8 shows aninverter, which performs the inversion function, as does the inverter ofFIG. 1. However, in FIG. 8, the connection C between the drains D isfabricated from the same polysilicon layer as the gate G. Trace C andthe gate G are coplanar. The polysilicon layer is labeled POLY in FIG.2.

Using polysilicon for this interconnect eliminates the trace T in FIG. 1which occupies METAL 2. (FIG. 3 illustrates a proliferation of thesetraces T on METAL 2.) With trace T eliminated, the entire layer of METAL2 can now be used for routing traces which interconnect MACROs and otherfunctional blocks. This new availability of METAL 2 provides asignificant increase in area available for traces, for two majorreasons, as will now be explained.

First, the metal traces on a given layer are generally parallel, asshown in FIG. 9. Traces on different layers are connected by vias,indicated by the dashed lines. It can be shown, based on simpleassumptions, that, after clearing of METAL 2 of traces T in FIG. 3, thenumber of metal traces which can be fabricated on METAL 2 is therebyincreased by about thirty percent. One contributor to this thirtypercent value is the fact that the space formerly occupied by traces Tis now available for use, whereas previously it was not.

Second, an additional benefit will be explained by first explaining asituation common in the prior art. Different traces can possessdifferent effective widths. For example, in FIG. 10, trace T1, whichcontains no associated pads for via connections, has an effective widthequal to its own width W1. In this example, W1 is assumed to be 1.0micron, as indicated. (However, in reality, W1 is typically 0.5-2.0microns.)

In contrast, trace T2 does contain via-pads P. Its effective width islarger, and equal to the via-pad width W2. In this example, W2 isassumed to be 2.0 microns, as indicated. (However, in reality, W2 istypically 1.0-4.0 microns.)

A minimum separation D in FIG. 10B must exist between adjacent traces.The minimum separation D is based on effective widths, determined by anedge such as E1, and not by edge E2. A distance D of 1.0 microns will beassumed. (In reality, a spacing D of 0.5-2.0 microns, for traces of0.5-2.0 microns width, is common.)

This spacing D can be allocated to each trace, by attributing one-halfto each side of a trace, as shown in FIG. 10C. The one-half spacing islabeled D/2. Consequently, trace T1, effectively becomes a rectanglewhich is 2.0 microns wide, as indicated in FIG. 10C; similarly, trace T2effectively becomes a rectangle 3.0 microns wide.

One must now inquire how many of these rectangles can be packed betweenthe prior-art traces T in FIG. 3.

FIG. 11 illustrates the eleven possible ways to pack traces T2 (of widthW2 in FIG. 11) and T1 (of width W1) between traces T. Distance D1 isassumed to be 9.0 microns. The hatched areas represent unused space.

If one assumes that each of the eleven possible combinations is equallylikely to occur in an actual integrated circuit, then the average wastedspace is the numerical average of the hatched areas. A statisticalanalysis of a given IC layout can be undertaken to ascertain the actualprobabilities of each combination, and may produce a different answerthan a simple numerical average of the possibilities in FIG. 11.Nevertheless, it is reasonable to assume that the combinations whichleave no wasted space, namely, W2-W2-W2 and W2-W1-W1-W1, will neveroccur with 100 percent frequency; some wasted space will always occur.

FIG. 12 illustrates how the traces can be packed onto METAL 2 layershown in FIG. 2, when the traces T in FIG. 3 have been eliminated. Thetraces T1 and T2 can be packed with maximum density. The only spacewhich is left over is the hatched area at the right. It is clear, basedon simple observation, that the wasted space in FIG. 12 is less thanthat in FIG. 11.

Further, based on reasonable assumptions, it can be calculated that thetotal wasted space in FIG. 12 will be about 40 percent of the wastedspace in FIG. 11.

Therefore, by fabricating the trace T in FIG. 8 from polysilicon, in thesame polysilicon layer as the gate G, the prior art array of traces T inMETAL 2 in FIG. 3 has been eliminated. This elimination provides athirty percent increase in space, due to factors which include therecovery of the space occupied by the traces T themselves. Thiselimination further provides a forty percent reduction in waste, byallowing packing of the type shown in FIG. 12 to be attained, as opposedto that of FIG. 11.

If Uniform Spacing is Required in Prior Art, Waste is Even Greater

The eleven possibilities shown in FIG. 11 may not all be available. Forexample, some routing techniques, both computer-executed and manual,follow a rule which requires that all traces lie upon imaginary lines offixed, uniform spacing, such as the lines H and V in FIG. 9. Under sucha rule, several possibilities in FIG. 11 would not be available. Forexample, any possibility which mixes W1 with W2 would be unavailable,(because spacing is not equal with this mixing).

Further, other rules are even more restrictive, and require that thetraces be laid out on a grid having the largest spacing, which wouldequal W2 in FIG. 10A. Under this rule, only three possibilities of FIG.11 would be available, namely,

(1) W2,

(2) W2-W2, or

(3) W2-W2-W2.

The other 8 possibilities are not available.

Under either of these two rules, some of the possibilities of FIG. 11are eliminated. It is clear that, under the added restrictions, thetotal wasted space becomes greater than if these possibilities wereallowed.

Use Same Row Pitch For MACRO Embedded in Standard Cell Array

In a second aspect of the invention, a MACRO is embedded within astandard cell array using the same ROW PITCH in the MACRO as in thearray, as indicated in FIG. 13. The different sizes indicate that theMACRO's cells need not be the same size as the standard cell array's,although they can be.

Under this layout, the same power busses, Vdd and Vss, feed both theMACRO cells and the standard cell array cells. Further, preferably,within the MACRO, no local interconnect is made on metal level 2(labeled METAL 2 in FIG. 2). That is, within the MACRO, there are notraces such as T shown in FIG. 3 located on metal level 2. Stated again,metal level 2 within the MACRO is preferably free of local interconnect.

This absence of local interconnect allows great flexibility in routingchip interconnect across the MACRO and also allows compaction of theinterconnect into very small spaces which are located over the MACRO.

Optimize Channels in FETs After Layout

The transistors used contain channels, through which carriers flow fromsource to drain. One channel is shown in FIG. 14. It is possible tofabricate channels having different WIDTHs, by adjusting the maskingused in fabrication.

Different WIDTHs result in different associated capacitances, such asthe gate capacitance, and also result in different transconductances.

Different capacitances can be desired for different transistors. Forexample, the channel in a transistor used as a load preferably has anarrow WIDTH, to minimize capacitance. Conversely, the channel in atransistor used as a driver (of a load) preferably has a wider WIDTH, tomaximize transconductance.

Under the invention, a given integrated circuit is laid out, using theabove principles, including (a) the clearing of METAL 2 of localinterconnect, and (b) the use of the same ROW PITCH in a MACRO and astandard cell array in which the MACRO is embedded. Then, thecapacitances of selected transistors are computed. (The capacitancescannot be calculated before this time, because the capacitance of eachtransistor depends on the traces leading to the transistor, as well ason the traces running next to, and over, it.)

If this computation indicates that some capacitances are not optimal,then the WIDTHs of the channels of the non-optimal transistors can bechanged. The WIDTHs of load transistors can be reduced, and the WIDTHsof driver transistors can be widened.

The inventor notes that the trimming is probably limited by a factor ofabout three. That is, if the smallest WIDTH possible is used initially,then it is probable that the WIDTH cannot be increased by greater than afactor of three. Conversely, if the largest possible WIDTH is usedinitially, then it is probable that the WIDTH cannot be reduced bygreater than a factor of 1/3. The primary reason is that the maximumWIDTH must lie within the cell boundaries (cells are shown in FIG. 3),and the minimum WIDTH is limited by the minimum masking dimensionsavailable.

Therefore, under the invention,

(a) METAL 2 is freed of local interconnect, partly by constructingdrain-drain interconnect within the polysilicon layer (POLY in FIG. 2).

(b) MACROs have no local interconnect within METAL 2.

(c) When MACROs are embedded within standard cell arrays, they are giventhe same ROW PITCH as the standard cell array itself.

(d) After layout (which is a conceptual step, done either on paper or bycomputer) and before fabrication, the relevant capacitances of selected(or all) transistors is computed. If any capacitances are non-optimal,the channel WIDTH is reduced or increased, as appropriate.

Invention Allows Non-Uniform Spacing of Interconnect.

Typical Prior-Art interconnect traces are positioned on an x-y grid offixed spacing. That is, as shown in FIG. 9, all horizontal traces mustrun along horizontal dashed lines H, and all vertical traces must runalong vertical dashed lines V. (As a consequence, since all vias mustlie upon an intersection point of a horizontal trace and a verticaltrace, the vias will lie on a grid point GP.)

In contrast, under the invention, the spacing of the traces can benon-uniform. FIG. 12 illustrates the non-uniform spacing.

Additional Considerations

1. "Local Interconnect" refers to signal traces which run between twolocations in a given functional block of transistors, or othercomponents. As an example, FIG. 15 illustrates an analog switch. (Thediscussion above has presumed standard cell arrays of CMOS devices; FIG.15 shows BJTs. The appearance of BJTs is purely incidental.) All of theinterconnections in that Figure are "local interconnects," with twoexceptions:

(1) The power and ground lines are not considered local interconnect,because the term is not applied to such lines.

(2) The line carrying the CONTROL VOLTAGE is not a local interconnect,because it carries the actuation signal for the analog switch. Ingeneral, this actuation signal will originate at a location which isunrelated to, and independent of, the location of the analog switch.

Therefore, FIG. 15 illustrates one definition of "local interconnect."Local interconnect includes traces which carry signals from onecomponent to another within a given functional block, and which assistin the execution of the block's function. The line CONTROL VOLTAGE,which carries the incoming signal, is not local interconnect, because itinitiates execution of block's function.

Another definition of local interconnect is again related to functionalblocks. Integrated circuit are frequently constructed using MACROs andother functional blocks contained in a library. Each MACRO andfunctional block can operate isolated, by itself (provided it receivespower and input signals). The traces contained within each isolatedMACRO and functional block (except power, input and output traces) arelocal interconnect.

2. The invention applies to integrated circuits having high levels ofintegration. For example, the invention applies to ICs of overalldimension of 5×5 mm, or greater. Such ICs are fabricated using VLSI/ULSItechniques.

3. The discussion above considered parallel power busses, such as Vddand Vss in FIG. 6. In the present context, "parallel" does not meanconcentric. For example, if a second ring (for Vss) in FIG. 7 were to befabricated, parallel with the Vdd ring shown, the two rings would not beconsidered "concentric".

4. In FIG. 13, the power busses Vdd and Vss run parallel, and they arealigned to both the cells of the standard cell array and the cells ofthe MACRO.

5. Under the invention, a MACRO having a fixed, predetermined layout isembedded in a standard cell array. Since the placement does not alterthe design of the MACRO, the MACRO's timing is not be affected by thisembedding.

6. The final gate width adjustments (or channel width adjustments),discussed above, are accomplished by the use of computer simulations. Aseries of timing simulations of the circuit are run, in which transistorgate widths are incrementally changed, and the resulting change in thelogic timing are observed.

If timing is improved, the new increment is likely to be retained. Ifthe timing worsens, the new increment is likely to be rejected.

The simulations are repeated until the widths converge on fixed values.This technique is known in the art as simulated annealing.

7. A third and fourth layer of metal interconnect can be utilized inaddition to the interconnect, discussed above, provided by (a) thepolysilicon layer, (b) METAL 1 and (c) METAL 2 layers. These additionallayers maximize the cell density in the layout by providing layers ofmetal interconnect that can be freely routed over the cells. That is,these layers are not subject to the restrictions discussed above.

Numerous substitutions and modifications can be undertakenwithoutdeparting from the true spirit and scope of the invention. Whatis desired to be secured by Letters Patent is the Invention as definedin the following claims.

I claim:
 1. In an integrated circuit which includes multiple physicallayers of interconnect, the improvement comprising:at least one physicallayer of interconnect consisting essentially of local interconnect; atleast one physical layer of interconnect consisting essentially ofglobal interconnect; and different spacings between adjacentinterconnect traces on one of the physical layers.
 2. An integratedcircuit, comprising:a) a MACRO embedded in a standard cell array, havingsubstantially the same row pitch as that of the standard cell array; b)parallel power busses which supply both the MACRO and the standard cellarray; c) a level of metallization which is free of local interconnect;d) in said level of metallization, interconnect traces havingnon-uniform spacing; and e) at least one CMOS inverter comprising ap-channel and n-channel transistor, utilized by the IC, wherein drainsof the p-channel and n-channel transistors are interconnected bypolysilicon.
 3. In a logic inverter, comprising an n-channel and ap-channel field-effect transistor, a polysilicon gate extending overtheir respective channels, and a polysilicon conductor connecting drainsof the two transistors, and further comprising a physical layer ofinterconnect traces which contains exclusively global interconnect, saidphysical layer being one of a plurality of physical layers of anintegrated circuit.
 4. Apparatus according to claim 3 in which the layerof interconnect traces have a non-uniform spacing.
 5. In an integratedcircuit which includes multiple physical layers of interconnect, theimprovement comprising:a physical layer of interconnect consistingessentially of local interconnect traces which carry signals from onecomponent to another within a given functional block; and a secondphysical layer of interconnect comprising global interconnect, andcontaining none of the local interconnect.
 6. The integrated circuit ofclaim 5, wherein the integrated circuit comprises a standard cell array.7. The integrated circuit of claim 5, wherein the component is a cell.8. In an integrated circuit which includes multiple physical layers ofinterconnect for providing local and global interconnect, theimprovement comprising:a physical layer of interconnect comprising thelocal interconnect, and containing none of the global interconnect; asecond physical layer of interconnect comprising the local interconnect;and an insulator layer at least partially between the physical layer ofinterconnect and the second physical layer of interconnect.
 9. In anintegrated circuit which includes multiple physical layers ofinterconnect for providing local and global interconnect, theimprovement comprising:a physical layer of interconnect comprising thelocal interconnect, and containing none of the global interconnect; asecond physical layer of interconnect comprising the local interconnect;and a third physical layer of interconnect comprising the globalinterconnect, and containing none of the local interconnect.